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Applications
The Heidelberg Instruments MLA 150 is a maskless aligner for direct-write lithography
Capabilities
- Write mode I for feature sizes down to 0.6 micrometers and feature separation down to 0.8 micrometers.
- Gray scale exposure mode
- Front and backside alignment capability,
- 405 nm and 375 nm exposure wavelengths,
- field by field wafer mapping alignment,
- It accommodates substrates from 5 mm to 225 mm, with thicknesses up to 12mm.
- Alignment accuracy is 250 nm for local alignment, 500 nm for global alignment, and 1000 nm for backside alignment. The maximum writing speed is 285 mm²/min for both wavelengths.
Arrival
September 2024
Available
Operational - Installed and ready for users as of November 2024