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LPCVD LTO - B3

MRL Industries Furnace for low temperature oxide deposition on silicon based substrates

MRL Furnace
Manager: Phil Infante
Backup: Aaron Windsor , Daniel McCollister

Description:

The LPCVD Low Temperature Oxide furnace is a low pressure CVD furnace with a 40” flat zone capable of processing up to 6” diameter wafers. Process gases used are SiH4 and O2. Samples are restricted to silicon based materials only.

Capabilities:

  • Low Temperature deposited Oxide
  • 20 nm/min dep rate at 425°C


Additional Resources:

Location of tool in cleanroom (jpg)


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