Dicing Saw - DISCO
DISCO Dicing Saw
Manager: Sam WrightBackup: John Treichler , Michael Skvarla
DISCO is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details.
With the following blade change schedule we hope to satisfy the needs of as many users as possible:
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This material is based upon work supported by the National Science Foundation under Grant No. NNCI-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
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Cornell NanoScale Science & Technology Facility (CNF)
250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700
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