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Dicing Saw - DISCO

DISCO Dicing Saw

Manager: Sam Wright
Backup: John Treichler , Michael Skvarla


DISCO is a dicing saw capable of handling up to 8 inch substrates with a thickness of up to 1.25 mm. Applications that have benefited from the DISCO approach include the dicing of silicon, bonded Si wafers, and all types of glasses. Please contact the staff for details.


  • 2” Front-mount Spindle
  • air driven DC brushless with closed-loop control
  • Optimized for simple and tight tolerance products up to 8”x 8”
  • Closed-loop, Y-axis linear encoder
  • Non-contact, optical height sensing
  • Pattern Recognition System with auto-focusing & programmable illumination

Processes Available:

With the following blade change schedule we hope to satisfy the needs of as many users as possible:

Sunday: all purpose blade (cuts all types of glasses and silicon)
Monday: all purpose blade
Tuesday: all purpose blade
Wednesday: S1235 blade (cuts silicon only), change will be between 8am-12noon
Thursday: S1235 blade
Friday: Change to all purpose blade between 8am-12noon
Saturday: all purpose blade

We will offer blade change trainings to experienced users who wish to be independent of this schedule. Please contact us if you have any concerns and further suggestions!


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