AJA Sputter Deposition
Load-lock single wafer, AJA sputter tool for deposition of thin metallic and dielectric films
Manager: Tom PennellBackup: Jerry Drumheller
A cryopumped sputter deposition system allows deposition of a variety of metals and dielectrics. A full target list is available below. Both RF and DC sputtering is available on this system. This is a single wafer load-lock tool capable of accommodating up to 6 inch wafers. With rotation during deposition, less than 1% uniformity is encountered over a 4 inch substrate.
Targets available (3 inch diameter)are: Al, Al+1%Si, Al+1%Si+4%Cu, Cr, Cu, MoSi, SiO2 (RF TARGET), Ti, TiW, W, Ta, Mo, Pt, Ge, Si, Nb
Additional Resources:AJA Target Changing Policy
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
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