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PVD75 Sputter Deposition
ITO Sputter Deposition System 
Manager: Aaron Windsor
Backup: Phil Infante
Description:The Kurt J. Lesker sputtering tool is currently configured to sputter Indium-Tin Oxide (ITO). The tool uses a 90% Indium /10% Tin target to reactively sputter with the oxygen introduced into the chamber. The composition of the ITO can be varied by controlling the percentage of oxygen that is introduced into the chamber. The lower the oxygen content; the more uniform, but the less transparent and more metallic the film will be. The tool has substrate rotation and heating capabilities up to 350°C. By heating the substrate you can create denser films. The tool has two platens: one for three 4" wafers and one that can handle a single wafer up to 8" in size. Uniformity ranges from 3-10% depending on how the sample is mounted. Capabilities:
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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. If you have a disability and are having trouble accessing information on this website or need materials in an alternate format, contact web-accessibility@cornell.edu for assistance. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |
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