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ABM Contact Aligner

Flexible 200mm Mask Aligner with DUV light source

ABM Contact Aligner Backup: Garry Bordonaro


ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200 mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200 mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation. The printing resolution is 0.8 µm for Near-UV and 0.4 µm for Mid-UV and Deep-UV in vacuum contact mode. Exposures in Mid- and Deep-UV require quartz masks.


  • Hard or Soft Contact Modes
  • Any size or shape sample up to 200mm and 0.250in.
  • UV, Mid-UV, and DUV Exposure Modes
  • Split-field CCD Zoom Microscope Alignment System
  • Bottom-mounting Mask Holders


Near-UV Vacuum Contact, Rohm and Haas S1805 550nm, PAB 115C 45 sec., ABM 1.1 sec., PEB 115C 30 sec., Dev. 300MIF 45 sec.

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