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K&S Gold Ball Bonder
![]() Manager: Jerry Drumheller
Description:This is a Wire bonding system used to make electrical connections between the bonding pads on chips, and the gold bonding pads on a chip carrier, or package. It uses .001 inch Gold wire with a combination of ultrasonics at the bonding tip, and heat on the device to make these connections. An electronic flame-0ff is used to melt a ball on the end of the wire which makes the first bond. The second bond can be made in any direction from the first bond.. The device to be bonded must be thermally coupled to the stage, and heated to about 170 degrees C. Capabilities:Two different modes of operation are always available.. A manual Z mode allows the operator to control the bonding head vertical motion, and a Chessman mode using preset search heights can also be used. Back to Top |
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![]() This material is based upon work supported by the National Science Foundation under Grant No. NNCI-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. If you have a disability and are having trouble accessing information on this website or need materials in an alternate format, contact web-accessibility@cornell.edu for assistance. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |