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CVC Sputter Deposition
Magnetron Sputter system for depositing thin metal & dielectric films ![]() Manager: Jerry Drumheller
Backup: Sam Wright
Description:A cryopumped CVC 601 sputter deposition system allows deposition of a variety of metals. A full target list is available below. Both RF and DC magnetron sputtering are available. Materials can be co- deposited from two sources onto the rotating substrate. Eight-inch sputtering targets are used, allowing batch depositions over 3-inch to 6-inch wafers. Smaller pieces are easily used. Capabilities:
Processes Available:Targets available (8 inch diameter)are: Al, Al+1%Si, Al+1%Si+4%Cu, Co, Cr, Cu, Mo, MoSi, Nb, Si, SiO2, Ta, Ti, TiW, W Applications:Additional Resources:CVC Sputter Deposition target request and changing proceduresBack to Top |
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![]() This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |