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Hamatech Post CMP Brushcleaner
Wafer processor for cleaning wafers after CMP ![]() Manager: Christopher Alpha
Description:A Hamatech wafer processer has been converted for use as a post CMP brushcleaner. The tool uses a soft PVA sponge 'brush' to remove slurry particles from the wafer surface after polishing. Dilute ammonium hydroxide is added to improve the slurry particle removal. The wafers are then rinsed and spun dry. Additional Resources:Operating InstructionsBack to Top |
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![]() This material is based upon work supported by the National Science Foundation under Grant No. NNCI-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation. If you have a disability and are having trouble accessing information on this website or need materials in an alternate format, contact web-accessibility@cornell.edu for assistance. Cornell NanoScale Science & Technology Facility (CNF) 250 Duffield Hall, Cornell University, Ithaca, New York 14853-2700 Voice: 607-255-2329, Fax: 607-255-8601, Email: information@cnf.cornell.edu Powered by ITX |