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Hamatech Post CMP Brushcleaner

Wafer processor for cleaning wafers after CMP

Hamatech Post CMP Cleaner
Manager: Christopher Alpha

Description:

A Hamatech wafer processer has been converted for use as a post CMP brushcleaner. The tool uses a soft PVA sponge 'brush' to remove slurry particles from the wafer surface after polishing. Dilute ammonium hydroxide is added to improve the slurry particle removal. The wafers are then rinsed and spun dry.


Additional Resources:

Operating Instructions


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This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.

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